| Abstract: |
This paper provides a detailed empirical analysis of hybrid cooling systems for high-power electronic devices under high thermal loads. With the increasing demand for modern power electronics Heat Dissipation capability above 100 W/cm², typical singular mode cooling methods have become insufficient. Under a series of experimental tests up to 1000 W power inputs in a controlled laboratory environment using six different cooling configurations including forced air convection, single-phase liquid-cooling, two-phase flow technology, as well as thermoelectric cooler (TEC)-assisted liquid cooling and nanofluid-enhanced hybrid arrangements; we found that the highest reduction of junction temperatures was observed for those fabricated with nanofluid-enhanced microchannel liquid-cooling systems in conjunction with TEC modules that show minimum recordings of junction temperature at 52.7°C/800 W input power which represents an average decrease of 50.3% from baseline air coolings have relatively low thermal performances across some test parameters. Using an optimal hybrid system produced coefficient of performance (COP) of 13.2, exceeding all individual cooling modes. Five tabulated datasets succumbed to statistical analysis confirming very strong inverse correlations between both thermal resistance and hybrid system complexity (r = −0.97, p < 0.01). |
